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PS7200U-1A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
? Peak reflow temperature
? Time of peak reflow temperature
? Time of temperature higher than 220 ° C
? Time to preheat temperature from 120 to 180 ° C
? Number of reflows
? Flux
260 ° C or below (package surface temperature)
10 seconds or less
60 seconds or less
120 ± 30 s
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260?C MAX.
220?C
to 60 s
180?C
120?C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
? Temperature
? Time
? Preheating conditions
? Number of times
? Flux
260 ° C or below (molten solder temperature)
10 seconds or less
120 ° C or below (package surface temperature)
One
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
? Peak temperature (lead part temperature)
? Time (each pins)
? Flux
350 ° C or below
3 seconds or less
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100 ° C.
(4) Cautions
? Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
Preliminary Data Sheet PN10544EJ02V0DS
7
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